Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. Products include solders and fluxes brazes thermal interface materials sputtering targets indium, gallium, germanium, and tin metals and inorganic compounds and NanoFoil ®. Hi everybody, I got AuSn (80 gold) preforms debris (small foils 100 micrometers thick (a few millimeters length and width) and I would like to know if it. Film deposition techniques include sputtering, evaporation, and electroplating, involving either single or multiple layers. SOLDER TYPES & DEPOSITION METHODS For the studies covered in this paper, the types of solder include preforms, pastes, and deposited films. Indium Corporation's Pb-free and RoHS-compliant AuSn solder preforms are available in a variety of standard and custom-engineered designs.įor more information about Indium Corporation's AuSn solder preforms, see our experts at the show or visit Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. for eutectic AuSn solder on Ni under bump metallization (UBM) and bare Cu19,40. Additionally, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength. The semiconductor-grade AuSn preforms are designed to meet industry challenges as devices continue to get smaller, with increasing power density and power ratings.ĭepending on the alloy, gold-based solders have a melting point ranging from 280-1,064☌, making it compatible with subsequent reflow processes. Indium Corporation's AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the 48 th NEPCON Japan, Jan. ? Indium Corporation to Feature AuSn Solder Preforms at NEPCON Japan 2019 November 15, 2018 The medium used for component attach is key aspect of LED assembly. SiP & Heterogeneous Integration & Assembly (HIA) Evaluation of HB LED AuSn Preforms & Eutectic Solder Paste.The Indium Corporation & Macartney Family Foundation.
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